Gigabyte X570 I AORUS PRO WIFI AMD Socket AM4 Mini ITX HDMI/DisplayPort DDR4 Dual PCIe 4.0 M.2 WiFi 6 RGB Motherboard

Supports AMD 3rd Gen Ryzen/ 2nd Gen Ryzen/ 2nd Gen Ryzen with Radeon Vega Graphics/ Ryzen with Radeon Vega Graphics Processors
Dual Channel ECC/ Non-ECC Unbuffered DDR4, 2 DIMMs
Direct 8 Phases IR Digital VRM Solution with PowIRstage
Advanced Thermal Design with Extended & Multi-Layered Heatsink
Dual Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with one Thermal Guard
Intel WiFi 6 802.11ax 2T2R & BT 5
ALC1220-VB Enhance 114dB(Rear)/ 110dB(Front) SNR in Microphone with Nichicon Audio Capacitors
Intel GbE LAN with cFosSpeed Internet
RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Supports Addressable LED & RGB LED Strips
Smart Fan 5 features Multiple Temperature Sensors and Hybrid Fan Headers with FAN STOP
Rear USB 3.1 Gen2 Type-C Header & HDMI 2.0 support
Integrated Base Plate & I/O Shield Armor
Q-Flash Plus update BIOS without installing CPU, Memory and Graphics card

DOMINANT IN DARKNESS
In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem.

GET READY FOR AMD RYZEN 3000-SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.

Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzen CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.

Advanced Thermal Design
On a small mini-ITX board, heat is easily trapped and thermal balance is not easy to achieve. To avoid thermal throttle, an improved thermal solution consisting of a heatsink with cuts, and multi-layered heatsink has been implemented on the X570 I AORUS PRO WIFI. With a LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.

Full PCIe 4.0 Design
X570 AORUS pushes the envelope once again by featuring Full PCIe 4.0 Design, including PCIe 4.0 slots, PCIe 4.0 M.2 connectors, and delivering highly optimized performance and flexibility demanded for power users and extreme gaming enthusiasts.

Specifications

CPU
AMD Socket AM4, support for: 3rd Generation AMD Ryzen processors/ 2nd Generation AMD Ryzen processors/ 2nd Generation AMD Ryzen with Radeon Vega Graphics processors/ AMD Ryzen with Radeon Vega Graphics processors

Chipset
AMD X570

Memory
3rd Generation AMD Ryzen processors:
Support for DDR4 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules
2nd Generation AMD Ryzen processors/2nd Generation AMD Ryzen with Radeon Vega Graphics processors/AMD Ryzen with Radeon Vega Graphics processors:
Support for DDR4 3600(O.C.) / 3400(O.C.) / 3333(O.C.) / 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules*
* ECC is only supported with AMD Ryzen PRO-series CPU.
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules

Onboard Graphics
Integrated Graphics Processor:
1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz
* Support for DisplayPort 1.2 version.
2 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
* Support for HDMI 2.0 version, HDCP 2.2, and HDR.
Support for up to 3 displays at the same time
Maximum shared memory of 16 GB

Audio
Realtek ALC1220-VB codec
* The back panel line out jack supports DSD audio.
High Definition Audio
2/4/5.1/7.1-channel
* To configure 7.1-channel audio, you have to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.

LAN
Intel GbE LAN chip (10/100/1000 Mbit)

Wireless Communication Module
Wi-Fi 802.11a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band
BLUETOOTH 5.0
Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
* Actual data rate may vary depending on environment and equipment.

Expansion Slots
Integrated in the CPU (PCIEX16):
3rd Generation AMD Ryzen processors:
1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen processors:
1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16)
2nd Generation AMD Ryzen with Radeon Vega Graphics processors/AMD Ryzen with Radeon Vega Graphics processors:
1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX16)
Integrated in the Chipset:
1 x M.2 Socket 1 connector for the wireless communication module (M2_WIFI)

Storage Interface
Integrated in the CPU (M2A_SOCKET):
3rd Generation AMD Ryzen processors:
1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 4.0 x4/x2 SSD support)
2nd Generation AMD Ryzen processors/2nd Generation AMD Ryzen with Radeon Vega Graphics processors/AMD Ryzen with Radeon Vega Graphics processors:
1 x M.2 connector (Socket 3, M key, type 2260/2280 SATA and PCIe 3.0 x4/x2 SSD support)
Integrated in the Chipset (M2B_SOCKET):
1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280 SATA and PCIe* x4/x2 SSD support)
* For 3rd Generation AMD Ryzen processors only.
4 x SATA 6Gb/s connectors
Support for RAID 0, RAID 1, and RAID 10

USB
Integrated in the CPU:
4 x USB 3.2 Gen 1 ports on the back panel
Integrated in the Chipset:
1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support
1 x USB 3.2 Gen 2 Type-A ports (red) on the back panel
2 x USB 3.2 Gen 1 ports available through the internal USB header
2 x USB 2.0/1.1 ports available through the internal USB header

Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
2 x system fan headers
1 x addressable LED strip header
1 x RGB LED strip header
4 x SATA 6Gb/s connectors
2 x M.2 Socket 3 connectors
1 x front panel header
1 x front panel audio header
1 x speaker header
1 x USB 3.2 Gen 1 header
1 x USB 2.0/1.1 header
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x Clear CMOS jumper

Back Panel Connectors
1 x DisplayPort
2 x HDMI ports
1 x USB 3.2 Gen 2 Type-A port (red)
4 x USB 3.2 Gen 1 ports
1 x USB Type-C port, with USB 3.2 Gen 2 support
1 x Q-Flash Plus button
1 x RJ-45 port
2 x SMA antenna connectors (2T2R)
3 x audio jacks

I/O Controller
iTE I/O Controller Chip

Hardware Monitoring
Voltage detection
Temperature detection
Fan speed detection
Overheating warning
Fan fail warning
Fan speed control

BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0

Operating System
Support for Windows 10 64-bit

Form Factor
Mini-ITX Form Factor; 17.0cm x 17.0cm